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Desktop precision polishing machine - List of Manufacturers, Suppliers, Companies and Products

Desktop precision polishing machine Product List

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Tabletop Precision Grinding Device "ALP-250 Model"

High precision and high rigidity frame structure with a tabletop machine! Achieved the creation of high-precision polished samples.

The "ALP-250 model" is a polishing device designed and created to produce observation surfaces for various analyses and evaluations, including semiconductor devices, MEMS devices, automotive parts, metals, coatings, resins, and ceramics. With its high-precision and highly rigid frame structure, this tabletop machine enables the creation of high-precision polished samples. It can safely operate at high rotational speeds of 200 rpm, allowing for free polishing in a short amount of time. 【Features】 ■ Designed and created to produce observation surfaces for various analyses and evaluations ■ Capable of three-station roller arms, allowing for a certain degree of mass production ■ Usable without jigs, can also be operated as a handheld lap ■ Can safely operate at high rotational speeds of 200 rpm, enabling free polishing in a short time *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Does not damage IC chips! Desktop precision grinding device 'AP-1000'

[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!

The "AP-1000" is a tabletop precision polishing device equipped with a high-precision 6-axis stage. Processing can be done simply by specifying the processing range of the sample on the GUI. There is no need for troublesome height adjustments. It can be used for package local unsealing processes and local substrate thinning processes. 【Features】 ■ Equipped with a high-precision 6-axis stage ■ Auto-leveling function ■ Load detection mechanism ■ Recipe registration function (up to 256 recipes) *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Tabletop Precision Grinding Device

This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.

We support everything from lapping (coarse polishing) to polishing, and we monitor and automatically correct the surface shape of the lapping plate itself with a resolution of 0.1μm. The polishing tool communicates with the main unit, allowing for chart displays of the polishing rate, setting of target polishing amounts, and configuration of multi-recipes. Additionally, we offer chemical models compatible with CMP for compound semiconductors such as GaAs and InP, enabling high-precision, high-speed, and damage-free CMP all with a single machine. (De-layering is also possible.)

  • CMP Equipment

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